Huikizne Reflow Oven T-962A, 110V 1500W Reflow Soldering Station, Micro-computer Control Reflow Soldering Machine with 11.8x12.6 Inch Soldering Area

Product ID:

250621

Identifier:

B0FM8P8H45

Brand:

Huikizne

Model:

AMZ-700002

Shipping Weight:

31.68 lbs

Manufacturer:

Huikizne

Shipping Dimension:

20 x 17.48 x 12.99 inches

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₱52,026

+ ₱ 14,112

International Shipping

Shipping Cost from USA to Philippines inclusive of custom fees.

Cost too high? Check weight and dimension on product details and click "I think this is wrong?" link.

Get it between 2025-11-20 to 2025-11-27.

Additional 3 business days for provincial shipping.

- Price and Stocks may change without prior notice

- Packaging of actual item may differ from photo shown

Electrical items MAY be 110 volts.

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7 Day Return Policy

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Cash On Delivery/Cash Upon Pickup Available

Cash upon Pick-up - orders grand total must not exceed ₱5,000.00. Order will be pickup at Galleon's Office.

Cash on Delivery - orders grand total must not exceed of ₱10,000.00 and must not exceed ₱5,000.00 for provincial areas. See all payment methods

FEATURES

Technical Parameter: Power supply: AC110V/ 50~60Hz, rated power: 1500W, drawer panel area: 11.8x12.6Inch (300x320mm), temperature range: 0℃-280℃, cycle time: 1～8 min, rated duty cycle: 100%

High-Capacity Processing: Features a large 300x320mm (11.8"x12.6") infrared heating zone with forced-air convection, enabling uniform temperature distribution (±2°C) for lead-free (max 280°C) and standard soldering applications

Integrated Fume Extraction System: Equipped with rear-mounted exhaust interface(suitable for Φ 110mm smoke exhaust pipe) ensures zero toxic fume leakage, maintaining health-compliant workspace conditions

Multiple Temperature Curve Selection: The reflow oven features eight preloaded temperature profiles and supports manual heating/forced convection cooling modes. All soldering processes execute automatically with user-friendly operation

Wide Application: Our machine can processes single/double-layer PCBs with fine-pitch components (CHIP, SOP, PLCC, QFP, BGA). Ideal for R&D, prototyping, and low-volume SMT production