MAX EPC A/B - Electronic Potting Compound for Embedding Electronic Printed Circuit Boards ● Encasing Electrical Circuitry● Waterproofing & Insulating ● High Thermal Conductivity 80 Fluid Ounce Kit

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About MAX EPC A/B - Electronic Potting Compound For

MAX EPC A/B is room temperature cured epoxy-based electronic potting compound designed for large mass potting or encapsulation of printed circuit boards & circuits. It produces low exothermic heat when cured in a large mass or thick cross-sections. Upon cure, it is electrically non-conductive and provides a permanent barrier against air, corrosive environments, moisture and direct contact with the circuitry. It's cured performance provides high thermal conductivity for fast dissipation of heat away from the circuitry. It demonstrates low shrinkage and excellent dimensional stability. MAX EPC A/B bonds to metals, FRP, ABS, PVC, Plastisol, & other plastic compounds used in wire jacketing and electrical enclosures. MAX EPC A/B is mixed 4:1 by weight; it provides a 90-minute working time for volumes of 3 cubic inches & up to 45 minutes for larger mass -6 cubic inches. Its mixed viscosity is 3100 cPs at 25°C, similar to the consistency of syrup or honey. It is poured into place, self-leveling and designed to release air bubbles and cure void-free. Upon cure, MAX EPC permanently encapsulates any PCB circuitry in an electrically non-conductive resin matrix that seals it permanently. It is waterproof & is suitable for continuous water immersion.MAX EPC is opaque black that offers permanent masking of proprietary circuits & components. MAX EPC is tough and impact resistant that demonstrates high compressive strength, and resistant to acids, bases, and solvents. MIX RATIO : 4:1 By WeightWORKING TIME: 90 Minutes @ 25°C CURE TIME: 48 Hrs @ 25°C ACCELERATED CURE: 2Hrs @100°CHARDNESS: 85 Shore DVOLUME RESISTIVITY: 1 x 10 exp16 Ω/CMDIELECTRIC STRENGTH: 500V/milTHERMAL CONDUCTIVITY:0.72 W/(m•K)SERVICE TEMPERATURE: -20°C to 100°CView Application Videohttps://youtu.be/I-GJtGdgUTM