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Silver-Bond 2NS Pure Silver Filled Electrically Conductive Non- SAG Epoxy, Maximum Continuity of Conductivity
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Silver-Bond 2NS Pure Silver Filled Electrically Features
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Appearance: Silver
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Cure Type: Heat cure or Room temperature
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Benefits: High strength Perfect bond Cold solder for heat-sensitive components
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Mix Ratio by weight: 100:8 / Resin:Hardener
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Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
About Silver-Bond 2NS Pure Silver Filled Electrically
Mix Ratio by weight: 100:8 / Resin:Hardener Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature: 60 to +160C Typical Applications: Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair Specific Gravity, mixed: 2.79 Reactive solids contents, %: 100 Pot Life: 1 Hour Shelf Life: 1 Year 15 minutes: @ 100C 45 minutes: @ 50C 24 hours: Room temperature Hardness, Shore D: 86 Shrinkage linear in/in: 0.0003 Lap shear strength, psi: 9800 Volume Resistivity ohm. cm: 0.0001 Thermal Expansion Coefficient, (cm / cm / C 10-5): 1.5 Thermal Conductivity, btu / hr / ft2 / F / in: 100 Tensile Strength, psi: 9500 Compressive Strength, psi: 14,000 Heat Distortion, C: 95 Electrical Resistivity:
