MAX MCR -Electronic Grade Potting Compound 4 Circuit Board, PCB Encapsulating, Embedding, Opaque Black Masking, Thin, Injectable, 1.5 Inch Thick Casting, Low Exotherm, Medium Set Time, 1.5 Gallon Kit

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MAX MCR -Electronic Grade Potting Compound 4 Features

• Electronic Potting and Encapsulating Compound For Printed Circuit Board -Insulate AC/DC High And Low Voltage

• Bonds to ABS PVC Plastic Housing, Wire Jackets, Mold Injected Components, Powder Coated And Metal Substrates

• None Electrically Conductive Epoxy Resin For Waterproofing And Embedding Electronic Components

• Opaque Black For Permanent Masking, Room Temperature Curing, 2:1 Mix Ratio, Medium Setting

• Cures Very Rigid, Up To 190°F (90°C) Operating Temperature

About MAX MCR -Electronic Grade Potting Compound 4

PRODUCT DESCRIPTION MAX MCR A/B is medium working time, low viscosity potting compound resin system for embedding and encapsulating printed circuit boards (PCB), relays, coils, and other electronic components and circuitry.MAX MCR A/B is low viscosity and is room temperature cured. It is mixed 2:1 by weight or by volume and provides a 30 minute working time (200-gram mass). The mixed consistency is similar to that of olive oil, and it is poured in place, injected, or adaptable for mix meter dispensing equipment.MAX MCR creates a permanent barrier that prevents direct physical contact with the circuitry. MAX MCR A/B cures to a hard and tough compound that is suitable for potting small to medium parts up to 6 ounces (180 grams) in mass without excessive exothermic heat generation.MAX MCR A/B bonds to PVC, PP, ABS, Plastisol, aluminum, steel, copper, brass and other materials typically used in electrical assembly and printed circuit boards.Upon cure, MAX MCR is tough, hard and completely waterproof suitable for continuous water immersion and exposure to harsh environments.Its opaque black color that permanently masks proprietary circuit design and identification of the electronic components. PHYSICAL PROPERTIES ROPERTIESMix Ratio: 2:1 by Weight Or VolumeMixed Viscosity: 1,950 cPs @75°FDensity: 1.10 G/CCWorking Time: 30 MinutesCure Time: 24 Hours @75°FAccelerated Cure: 2 Hours @ 200°FHardness: 78 Shore DVolume Resistivity: 4.7 X 1013 Ohms-CmDielectric Strength: 510 Volts/Mil 60 CyclesDielectric Constant: 4.0 (10 kHz)Dissipation Factor: 0.014 (10 kHz)Thermal Conductivity: 0.25 W F/mKAvailable Kit SizesCopy and paste the following link48 Fl.Ozhttps://www.amazon.com/dp/B01J1GGOA896 Fl.Ozhttps://www.amazon.com/dp/B01J1G1V7Y