4 IN 1 Mobile Phone CPU Disassemble Maintenance For Phone NAND CHIP IC Remove Rework 4 In 1

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4 IN 1 Mobile Phone CPU Disassemble Maintenance For Features

• New type cutting .

• Can solve the problem of removing CPU back/middle layer adhesive by cutting adhesive.

• 4 for prying CPU, IC hard , mobile phone motherboard, IC CPU removal, professional removal, and cutting black without damaging the motherboard.

• Manual polishing, flexible , damage.

• Remove the CPU maintenance tool.

About 4 IN 1 Mobile Phone CPU Disassemble Maintenance For