FDA-Bond 22 Medical Grade Epoxy Adhesive, Low Permeability to Gases and Vapors

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About FDA-Bond 22 Medical Grade Epoxy Adhesive, Low

Mix Ratio by weight: 100:40 / Resin:Hardener Substrates: Most metals, ceramic, glass and plastics Operating Temperatures: -70 to 145 C Typical Applications: Bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices. Viscosity @ 25 C, cps: 27,000 Thixotropic Index: 1.2 Specific Gravity, mixed: 1.44 Hardness, Shore D: 78 CTE, Linear: 26.1 in/in-F Dielectric strength kv/in: 420 Volume Resistivity ohm-cm: 1.50e+14 ohm-cm Elongation at Yield: 5.0 % Adhesive Bond Strength: 2100 psi Lap shear, alum to alum Dielectric Constant: 3.5 @ frequency 1000 Hz Dielectric Strength: 420 kV/in Dissipation Factor: 0.020 @ frequency 1000 Hz 1-4 Hours: @ 65C 24 to 36 Hours: @ 25C FDA-Bond 22 Medical Grade Epoxy Adhesive, Low Permeability to Gases and Vapors is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration (FDA) Chapter 1, Sub Part B, Sections 175.105 and 175.300.FDA-Bond 22 Medical Grade Epoxy Adhesive, Low Permeability to Gases and Vapors is two-parts tan adhesive is easily mixed, used and cured at room temperature for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.FDA-Bond 22 Medical Grade Epoxy Adhesive, Low Permeability to Gases and Vapors is an effective electrical insulator, and it provides low permeability to gases and vapors, and good resistance to water, weather, galvanic action, to petroleum solvents, lubricants and fuels, to mild acids and alkalis, and to many other organic and ino