Electrically & Thermally Conductive 1 Part Silver Epoxy Heat Cure High Temp 325C, Electro-Bond 04, 10gm syringe(s)

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About Electrically & Thermally Conductive 1 Part Silver

http://conductivex.com/Electrically-Thermally-Conductive-1-Part-Silver-Epoxy-Heat-Cure-High-Temp-325CElectro-Bond 04 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly. Electro-Bond 04 passes NASAs outgassing testing (ASTM E-595) and is listed in NASAs Outgassing Data for Selecting Spacecraft Materials list.Electro-Bond 04 offers excellent mechanical, electrical, and physical properties at continuous operating temperatures Up to 175C. This versatile silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication. This high performance conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures Up to 325C."Appearance - SilverBenefits - Microwave Applications for EMI and RFI shielding, for assembly and repair of circuit boards and electronic components manufacturing .Components - 1Compressive - 12000Cure Schedule - 2 hours @ 120 C1 hour @ 150 C1/2 hour @ 175 CCure Type - Heat CureFiller - Silver Hardness - 87Heat - 175Lap - 8500Operating - from 50 to +204COutgassing - 0.01Outgassing - 0.38Outgassing - 0.07Particle Size - 17Reactive - 100Shelf - 6 monthsSpecific - 2.69Substrates - aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit boardTensile - 8500Thermal - 2.99Thermal - 20.74Thermal - 0.49Typical - EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry Viscosity - Paste Volume Resistivity - 1.00 E-03Working - 6 months