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Solder Paste no clean Sn42/Bi57.6/Ag0.4 Low Temp 138C in 5cc syringe 15g (T5)
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About Solder Paste No Clean Sn42/Bi57.6/Ag0.4 Low Temp
Description Solder Paste Lead-Free Sn42/Bi57.6/Ag0.4 Low Temperature T5 mesh 5cc Syringe. Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 86% metal by weight. Particle Size: T5 (15-25 microns) Melting Point: 138C (281F) Size: 5cc/15g syringe Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
